New photosensitive polyimide system for sealing high-density semiconductor chip

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers

Volumn 40, Issue 10, 2001, Pages 6124-6128

  Tajima, Y ^a   Shigemitsu, Y ^a   Takeuchi, E ^a   Takeuchi, K ^a  

^a INST OF PHYS AND CHEMICAL RESEARCH   (Japan)

Author keywords

Fullerene; High density semiconductor chip; Photo oxidation induced polycondensation (POP); Polyimide

Indexed keywords

CROSSLINKING; DIFFUSION; FULLERENES; HEAT RESISTANCE; LASER APPLICATIONS; MICROPROCESSOR CHIPS; MOLECULES; OXYGEN; PHOTOLYSIS; PHOTOOXIDATION; PHOTOSENSITIVITY; POLYCONDENSATION;

FURAN SUBSTITUTED POLYIMIDE; HEAT RESISTANT PHOTOSENSITIVE POLYMER; LASER FLASH PHOTOLYSIS; PHOTOOXIDATION INDUCED POLYCONDENSATION; PHOTOSENSITIVE POLYIMIDE SYSTEM; PHOTOSENSITIZATION; POLYIMIDE FILM; POSTEXPOSURE BAKING;

POLYIMIDES;

EID: 0035485127     PISSN: 00214922     EISSN: None     Source Type: Journal    
DOI: 10.1143/jjap.40.6124     Document Type: Article

References (13)