Compact air-cooled heat sinks for power packages

IEEE Transactions on Components Packaging and Manufacturing Technology Part A

Volumn 20, Issue 4, 1997, Pages 442-451

  Aranyosi, Attila ^b   Bolle, Léon M R ^c   Buyse, Hervé A ^a,c  

^a IEEE

^b UNIVERSITY OF MISKOLC   (Hungary)

^c UNIVERSITÉ CATHOLIQUE DE LOUVAIN   (Belgium)

Author keywords

Air cooled heat sink; Heat sink; Jet impingement; Microchannel; Porous metal fiber; Power MOSFET; TSEP technique; Woven wire screen

Indexed keywords

ACOUSTIC NOISE; COOLING; ELECTRONICS PACKAGING; HEAT FLUX; HEAT LOSSES; MASS TRANSFER; MOSFET DEVICES; OPTIMIZATION; POWER ELECTRONICS; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR JUNCTIONS; VOLTAGE MEASUREMENT;

AIR COOLED HEAT SINKS; JET IMPINGEMENT; MICROCHANNEL HEAT SINKS; POROUS METAL FIBER HEAT SINKS; TEMPERATURE SENSITIVE ELECTRICAL PARAMETERS (TSEP); WOVEN WIRE SCREEN HEAT SINKS;

HEAT SINKS;

EID: 0031383642     PISSN: 10709886     EISSN: None     Source Type: Journal    
DOI: 10.1109/95.650933     Document Type: Article

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