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Volumn 30, Issue 9, 2001, Pages 1145-1151
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Interfacial reactions between a Pb-free solder and die backside metallizations
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Author keywords
Diode metallization; FET metallization; Interfacial reaction; Intermetallic compounds; Pb free solder; Ti Ni Ag metallization
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Indexed keywords
FIELD EFFECT TRANSISTORS;
INTERFACES (MATERIALS);
INTERMETALLICS;
LEAD;
METALLIZING;
MICROSTRUCTURE;
NICKEL;
REACTION KINETICS;
SCANNING ELECTRON MICROSCOPY;
SEMICONDUCTOR DIODES;
SILVER;
TITANIUM;
DIE BACKSIDE METALLIZATION;
DIODE METALLIZATION;
FIEL EFFECT TRANSISTOR METALLIZATION;
LEAD FREE SOLDER;
TITANIUM NICKEL SILVER METALLIZATION;
SOLDERING ALLOYS;
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EID: 0035454950
PISSN: 03615235
EISSN: None
Source Type: Journal
DOI: 10.1007/s11664-001-0142-8 Document Type: Article |
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Times cited : (5)
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References (10)
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