A fine pitch, lead-less chip assembly technology with the built-up PCB

International Journal of Microcircuits and Electronic Packaging

Volumn 19, Issue 4, 1996, Pages 462-467

  Tanaka, Kei ^a   Bonkohara, Manabu ^a   Dohya, Akihiro ^a   Shimada, Toshiyasu ^a   Tanioka, Michinobu ^a   Kimura, Teruyuki ^a  

^a NEC CORPORATION   (Japan)

Author keywords

Fine Pitch; Flip Chip Technology; Fluxless; Leadfree; MCM L

Indexed keywords

ALUMINUM; ASSEMBLY; LSI CIRCUITS; MULTICHIP MODULES; TECHNOLOGY;

ASSEMBLY TECHNOLOGY; FINE PITCH; FLIP CHIP ASSEMBLY;

FLIP CHIP DEVICES;

EID: 0030380492     PISSN: 10631674     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (4)

1. S. Tsukada, et al., "Surface Laminar Circuit and Flip Chip Attach Packaging," Proceeding of the 7th International Microelectronics Conference (IMC), pp. 252-258, 1992.
2. Y. Bessyo, et al., "A Stud-Bump-Bonding Technique for High Density Multi-Chip-Module," Proceeding of the Japan IEMT Symposium, pp. 362-365, 1993.
3. Y. Katoh, et al., "Solder Bump Forming Technology and It's Fixture" Proceeding of IEIC Fall Meeting, June 23, 1994.
4. T. Kuramoto, et al., "Recent technical movements for pre-coat of solder," JPCA Seminar, June 1995.