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Journal of Vacuum Science and Technology, Part A: Vacuum, Surfaces and Films
Volumn 19, Issue 5, 2001, Pages 2074-2082
Effects of wall contamination on consecutive plasma processes
(5)
Yasuda, H K
a
Yu, Q S
a
Reddy, C M
a
Moffitt, C E
b
Wieliczka, D M
b
a
University of Missouri
(
United States
)
b
UNIVERSITY OF MISSOURI KANSAS CITY
(
United States
)
Author keywords
[No Author keywords available]
Indexed keywords
ADHESION; ALUMINUM ALLOYS; CHEMISORPTION; CONTAMINATION; OLIGOMERS; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; PLASMA POLYMERIZATION; SILANES; SPUTTER DEPOSITION; SUBSTRATES;
PLASMA PROCESSES; WALL CONTAMINATION;
PLASMA INTERACTIONS;
EID
:
0035441804
PISSN
:
07342101
EISSN
:
None
Source Type
:
Journal
DOI
:
10.1116/1.1372902
Document Type
:
Article
Times cited : (
5
)
References (
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.
