CROSSING THE 200 WIRE BARRIER IN VLSI BONDING.

Volumn , Issue , 1984, Pages 353-357

  Dehaine, Gerard ^a   Kurzweil, Karel ^a   Lewandowski, Pierre ^a  

^a Fr ^*

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING - APPLICATIONS; INTEGRATED CIRCUIT MANUFACTURE; INTEGRATED CIRCUITS - FLIP CHIP CONSTRUCTION;

EXTERNAL CONNECTIONS PER CHIP; FLIP CHIP TECHNOLOGY; PACKAGE BONDING PAD CONFIGURATION; PIN GRID ARRAY PACKAGE CONCEPT; TAPE AUTOMATED BONDING; THERMOSONIC GOLD WIRE BONDING PROCESS;

INTEGRATED CIRCUITS, VLSI;

EID: 0021540276     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (6)