Growth kinetics of interfacial damage: Epoxy coating on a generic dual inline package

IEEE Transactions on Components and Packaging Technologies

Volumn 24, Issue 3, 2001, Pages 482-492

  Park, Jongwoo ^a   Gary Harlow, D ^b   Nied, Herman F ^b  

^a AGERE SYSTEMS   (United States)

^b Lehigh University   (United States)

Author keywords

Environmental scanning electron microscope; Frechet cumulative distribution function; Highly accelerated stress test; Image analysis; Interfacial damage; Kolmogorov Smirnov test; Leakage current; Maximum likelihood estimation; SEM EDX; X ray photoelectron spectrometry

Indexed keywords

EPOXY RESINS; FAILURE ANALYSIS; GROWTH (MATERIALS); INTERFACES (MATERIALS); LEAKAGE CURRENTS; OPTICAL MICROSCOPY; PROTECTIVE COATINGS;

EPOXY COATING; GENERIC DUAL INLINE PACKAGE; INTERFACIAL DAMAGE;

ELECTRONICS PACKAGING;

EID: 0035439778     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.946497     Document Type: Article

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