Phenomenological reliability modeling of plastic encapsulated microcircuits

International Journal of Microcircuits and Electronic Packaging

Volumn 19, Issue 1, 1996, Pages 3-13

  Kelkar, N ^a   Fowler, A ^a   Pecht, M ^a   Cooper, M ^a  

^a UNIVERSITY OF MARYLAND   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRON DEVICE TESTING; ELECTRONICS PACKAGING; ENCAPSULATION; FAILURE (MECHANICAL); MODELS; PLASTICS APPLICATIONS; RELIABILITY; SIMULATION;

PLASTIC ENCAPSULATED MICROCIRCUITS;

ELECTRONIC EQUIPMENT TESTING;

EID: 0030102262     PISSN: 10631674     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (52)