Development of fine pitch ball grid array

2nd 1998 IEMT/IMC Symposium

Volumn 1998-April, Issue , 1998, Pages 45-49

  Shibata, J ^a   Horita, M ^b   Izumi, N ^b   Shikano, T ^b   Okada, M ^b   Noguchi, Y ^b   Imamura, K ^b   Fukunaga, H ^a   Yasunaga, M ^a   Hirai, T ^b   Hashimoto, T ^a   Takemoto, Y ^a  

^a MITSUBISHI ELECTRIC CORPORATION   (Japan)

^b IC Assembly Engineering Dept   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; LOGIC DEVICES; MICROELECTRONICS; SOLDERED JOINTS;

ASSEMBLY PROCESS; GLASS EPOXY; MICRO CONTROL UNIT; PACKAGE STRUCTURE; PERFORMANCE AND RELIABILITIES; PORTABLE ELECTRONICS; SINGLE LAYER; WIRE BONDING;

BALL GRID ARRAYS;

EID: 37649026144     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1109/IEMTIM.1998.704514     Document Type: Conference Paper

References (5)

1. Shinji Baba et al. "Molded Chip Scale Package for High Pin Count" Proceeding of 1996 Electronic Components and Technology Conference, pp. 1251-1257
2. Masatoshi Yasunaga et al. "Chip Scale Package (CSP)"A Lightly Dressed LSI Chip"" Proceeding of 1994 IEEE/CPMT Int'l Electronics Manufacturing Technology Symposium, ppl69-176
3. Tomoki Shoji et al. "Methods of Mounted Reliability Evaluation for CSP" Proceeding of SEMI Technology Symposium 97 (SEMICON JAPAN) December 3-5, 1997 pp. 9-65-9-74
4. Laurene Yip et al. "Moisture Sensitivity Evaluation of Ball Grid Array Packages" Proceeding of 1996 Electronic Components and Technology Conference, pp. 829-835
5. Geok-Leong Tan et al. "Reliability Assessment of BGA Packages" Proceeding of 1996 Electronic Components and Technology Conference, pp. 687-693