An empirical crack propagation model and its applications for solder joints

Journal of Electronic Packaging, Transactions of the ASME

Volumn 118, Issue 2, 1996, Pages 104-107

  Hu, Jimmy M ^a  

^a FORD MOTOR COMPANY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CORRELATION METHODS; CRACK PROPAGATION; CREEP; FATIGUE OF MATERIALS; FRACTURE MECHANICS; LEAD ALLOYS; MATHEMATICAL MODELS; RELIABILITY; STRAIN; THERMAL CYCLING; THERMAL EFFECTS; TIN ALLOYS;

HOLD TIMES; LEADLESS SOLDER JOINTS;

SOLDERED JOINTS;

EID: 0030164692     PISSN: 10437398     EISSN: 15289044     Source Type: Journal    
DOI: 10.1115/1.2792128     Document Type: Article

References (10)

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2. Li, C., Subrahmanyan, R., Wilcox, J. R., and Stone, D., “A Damage Integral Methodology for Thermal and Mechanical Fatigue of Solder Joints,” Solder Joint Reliability—Theory and Application, (Lau, ed.), Van Nostrand Reinhold, New York, N.Y., 1991, pp. 361-383.
3. Guo, Z., Sprecher, A. F., and Conrad, H., “Effect of Sn Content on Crack Growth Rate in Low-Cycle Fatigue of Pb-Sn Solder Joints,” Proceedings of 5th Electronic Materials and Processing Congress, Cambridge, MA, ASM, 1992.
4. Lau, J. H., “Thermal Fatigue Life Prediction of Flip Chip Solder Joint by Fracture Mechanics Method,” International Journal of Fracture Mechanics, Vol. 45 No. 5, 1993, pp. 643-654.
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6. Paydar, N., Tong, Y., and Akay, H. U., “A Finite Element Study of Fatigue Life Prediction Methods For Thermally Loaded Solder Joints,” Advances in Electronic Packaging, EER-Vol. 4-2, ASME, 1993, pp. 1063-1069.
7. Pao, Y., Jih, E., and Reddy, V., “Thermal Fatigue Life Prediction of Surface Mount Solder Interconnects-A Design Integrated Approach,” Mechanics and Materials for Electronic Packaging: Design and Process Issues, the Proceedings of ASME Winter Annual Meeting, AMD-Vol 195, 1994, pp. 181-191.
8. Hu, J. M., “Physics-of-Failure Based Component Qualification of Automotive Electronics,” Communications in Reliability, Maintainability, and Sup-portability, An International Journal, Vol. 1, No. 2, SAE, pp. 21-33, 1994.
9. Hu, J. M., Barker, D., Dasgupta, A., and Arora, A., “The Role of Failure-Mechanism Identification in Accelerated Testing,” Journal of The Institute of Environmental Sciences, pp. 39-45, July/August 1993.
10. Hu, J. M., “A Technique To Reduce Sample Size in Accelerated Reliability Qualification Tests,” Mechanics and Materials for Electronic Packaging: Design and Process Issues, the Proceedings of ASME Winter Annual Meeting, AMD-Vol 195, 1994, pp. 117-123.