Microwave nondestructive detection of delamination in IC packages utilizing open-ended coaxial line sensor

NDT and E International

Volumn 32, Issue 5, 1999, Pages 259-264

  Ju, Y ^a   Saka, M ^a   Abe H ^a  

^a TOHOKU UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

DELAMINATION; ELECTRONICS PACKAGING; INSPECTION; INTEGRATED CIRCUIT MANUFACTURE; SENSORS;

COAXIAL LINE SENSOR; MICROWAVE NONDESTRUCTIVE DETECTION;

NONDESTRUCTIVE EXAMINATION;

EID: 0032629692     PISSN: 09638695     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0963-8695(98)00055-3     Document Type: Article

References (12)

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