Microwave imaging for the integrity assessment of IC packages

Journal of Electronic Packaging

Volumn 123, Issue 1, 2001, Pages 42-46

  Ju, Y ^a   Saka, M ^a   Abe H ^a  

^a TOHOKU UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

EID: 0038843805     PISSN: 10437398     EISSN: None     Source Type: Journal    
DOI: 10.1115/1.1326440     Document Type: Article

References (13)

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2. Tay, A. A. O., Tan, G. L., and Lim, T. B., 1994, "Predicting Delamination in Plastic IC Packages and Determining Suitable Mold Compound Properties," IEEE Trans. Compon., Packag. Manuf. Technol., Part B, 17, pp. 201-208.
3. Lee, H., and Earmme, Y. Y., 1996, "A Fracture Mechanics Analysis of the Effects of Material Properties and Geometries of Components on Various Types of Package Cracks," IEEE Trans. Compon., Packag. Manuf. Technol., Part A, 19, pp. 168-178.
4. Omi, S., Fujita, K., Tsuda, T., and Maeda, T., 1991, "Causes of Cracks in SMD and Type Specific Remedies," IEEE Trans. Compon., Hybrids, Manuf. Technol., 14, pp. 818-823.
5. Diener, L., 1995, "Microwave Near-Field Imaging with Open-Ended Waveguide - Comparison with Other Techniques of Nondestructive Testing," Res. Nondestruct. Eval., 7, pp. 137-152.
6. Gopalsami, N., Bakhtiari, S., Dieckman, S. L., Raptis, A. C., and Lepper, M. J., 1994, "Millimeter-Wave Imaging for Nondestructive Evaluation of Materials," Mater. Eval., 52, pp. 412-415.
7. Qaddoumi, N., Carriveau, G., Ganchev, S., and Zoughi, R., 1995, "Microwave Imaging of Thick Composite with Defects," Mater. Eval., 53, pp. 926-929.
8. Pozar, D. M., 1990, Microwave Engineering, Addison-Wesley, New York, NY.
9. Ju, Y., Saka, M., and Abé, H., 1997, "A Method for Nondestructive Testing of Defects in Dielectric Material Utilizing Coaxial Line Sensor Technique," Proc. International Conference on Materials and Mechanics '97, JSME, Tokyo, pp. 401-404.
10. Grant, J. P., Clarke, R. N., Symm, G. T., and Spyrou, N. M., 1989, "A Critical Study of the Open-Ended Coaxial Line Sensor Technique for RF and Microwave Complex Permittivity Measurements," J. Phys. E, 22, pp. 757-770.
11. Mosig, J. R., Besson, J. E., Gex-fabry, M., and Gardiol, F. E., 1981, "Reflection of an Open-Ended Coaxial Line and Application to Nondestructive Measurement of Materials," IEEE Trans. Instrum. Meas., IM-30, pp. 46-51.
12. Ju, Y., Saka, M., and Abé, H., 1999, "Microwave Nondestructive Detection of Delamination in IC Packages Utilizing Open-Ended Coaxial Line Sensor," NDT & E Int., 32, pp. 259-264.
13. Ju, Y., Saka, M., and Abé, H., 1998, "Microwave Imaging for Nondestructive Inspection of Delamination in IC Packages by Open-Ended Coaxial Line Sensor," Proc. of the Workshop on Mechanical Reliability of Polymeric Materials & Plastic Packages of IC Devices, ASME/IEEE-CPMT/IMAPS, Paris, EEP-Vol. 25, pp. 265-270.