Subcritical crack growth at bimaterial interfaces: Part I. Flexural peel technique

Metallurgical and Materials Transactions A: Physical Metallurgy and Materials Science

Volumn 27 A, Issue 1, 1996, Pages 205-211

  Zhang, Zhehua ^a   Shang, J K ^a  

^a UNIVERSITY OF ILLINOIS AT URBANA CHAMPAIGN   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CALCULATIONS; CRACK PROPAGATION; FINITE ELEMENT METHOD; FRACTURE MECHANICS; NUMERICAL ANALYSIS; SANDWICH STRUCTURES;

APPROXIMATE LINEAR ELASTIC FRACTURE MECHANICS; BIMATERIAL INTERFACES; COMBINED TENSILE AND SHEAR MODE; CRACK CLOSURE METHOD; CRACK TIP FIELD; FLEXURAL PEEL TECHNIQUE; SANDWICH SPECIMEN; SUBCRITICAL CRACK GROWTH;

INTERFACES (MATERIALS);

EID: 0029753156     PISSN: 10735623     EISSN: None     Source Type: Journal    
DOI: 10.1007/BF02647760     Document Type: Article

References (25)