Thick porous silicon formation using implanted mask technology

Sensors and Actuators, B: Chemical

Volumn 76, Issue 1-3, 2001, Pages 354-360

  Splinter, Alexandra ^a   Bartels, Olaf ^a   Benecke, Wolfgang ^a  

^a UNIVERSITY OF BREMEN   (Germany)

Author keywords

Implanted mask; Low power application; Porous silicon; Thermally decoupled membrane; Thick sacrificial layer

Indexed keywords

ION IMPLANTATION; MASKS; MICROMACHINING; POROUS SILICON; THICK FILMS;

THERMALLY DECOUPLED MEMBRANES;

SILICON SENSORS;

EID: 0035368302     PISSN: 09254005     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0925-4005(01)00630-X     Document Type: Conference Paper

References (9)

1. A silicon condenser microphone using bond and etch-back technology
2. 2-based microhotplate with integrated IDC for metal oxide gas sensors
3. Porous silicon formation mechanisms
4. Miromachining applications of porous silicon
5. Porous silicon as a sacrificial material
6. Porous silicon bulk micromachining for thermally isolated membrane formation
7. Front side bulk silicon micromachining using porous-silicon technology