SCOPUS 정보 검색 플랫폼

Microelectronics Reliability

Volumn 41, Issue 6, 2001, Pages 887-899

Reliability evaluation of a silicon-on-silicon MCM-D package

(8) Barton, J a McCarthy, G b Doyle, R c Delaney, K a Cabruja, E d Lozano, M d Collado, A d Santander, J d

a UNIVERSITY COLLEGE CORK (Ireland)

b EMC (Ireland)

c Inpact Microelectronics (Ireland)

d UNIVERSITAT AUTÒNOMA DE BARCELONA (Spain)

Author keywords

[No Author keywords available]

Indexed keywords

ATMOSPHERIC HUMIDITY; ELECTRONICS PACKAGING; FLIP CHIP DEVICES; SEMICONDUCTING SILICON; SEMICONDUCTOR DEVICE MANUFACTURE; SEMICONDUCTOR DEVICE STRUCTURES; SEMICONDUCTOR DEVICE TESTING; STRESS ANALYSIS; SUBSTRATES; THERMAL CYCLING;

PLASTIC BALL GRID ARRAYS;

MULTICHIP MODULES;

EID: 0035366907 PISSN: 00262714 EISSN: None Source Type: Journal
DOI: 10.1016/S0026-2714(01)00014-2 Document Type: Article

Times cited : (2)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.