Shell and gel BGA packaging of bell laboratories μinterconnect multichip modules

International Journal of Microcircuits and Electronic Packaging

Volumn 19, Issue 2, 1996, Pages 110-119

  Dudderar, T D ^a   Degani, Y ^a   Han, B J ^a   Raju, V R ^a  

^a LUCENT TECHNOLOGIES   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY; COST EFFECTIVENESS; ENCAPSULATION; FLIP CHIP DEVICES; MULTICHIP MODULES; PRINTED CIRCUIT BOARDS; RELIABILITY; SILICON WAFERS; SOLDERED JOINTS; SOLDERING; SURFACE MOUNT TECHNOLOGY; TELEPHONE EQUIPMENT;

BALL GRID ARRAY PACKAGING; MINIATURIZATION; REFLOW SOLDERING; RELIABILITY ENHANCEMENT; SOLDER BALL; SURFACE MOUNT ASSEMBLY; TELEPHONE PRODUCTS;

ELECTRONICS PACKAGING;

EID: 0030168090     PISSN: 10631674     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (7)