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IEEE transactions on components, packaging and manufacturing technology. Part C. Manufacturing
Volumn 20, Issue 3, 1997, Pages 213-218
Metallurgical considerations for accelerated testing of soft solder joints
Author keywords

[No Author keywords available]
Indexed keywords

DEFORMATION; ELECTRONICS PACKAGING; RECRYSTALLIZATION (METALLURGY); SOLDERED JOINTS; SOLDERING; SURFACE MOUNT TECHNOLOGY; THERMAL CYCLING; TIN ALLOYS;
EID: 0031176838     PISSN: 10834400     EISSN: None     Source Type: Journal    
DOI: 10.1109/3476.649443     Document Type: Article
Times cited : (7)
References (10)
  • 1
    • 0026963395 scopus 로고
    • R. Darveaux K. Banerji Costitutive relations for tin-based solder joints IEEE Trans. Comp., Hybrids, Manufact. Technol. 15 1013 1024 1992 33 5292 206925
    • (1992) , vol.15 , pp. 1013-1024
    • Darveaux, R.1    Banerji, K.2
  • 2
    • 51249173178 scopus 로고
    • Z. Mei D. Grivas M. C. Shine J. W. Morris Jr. Superplastic creep of eutectic tin.lead solder joints J. Electron. Mater. 19 1273 1280 1990
    • (1990) , vol.19 , pp. 1273-1280
    • Mei, Z.1    Grivas, D.2    Shine, M.C.3    Morris Jr., J.W.4
  • 3
    • 0026170636 scopus 로고
    • R. G. Ross Jr. A systems approach to solder joint fatigue in spacecraft electronic packaging J. Electron. Packag. 113 121 128 1991
    • (1991) , vol.113 , pp. 121-128
    • Ross Jr., R.G.1
  • 4
    • 0022752384 scopus 로고
    • Z. Minzhong H. W. Liu Fatigue crack growth under general yielding cyclic loading Eng. Mater. Technol. 108 201 205 1986
    • (1986) , vol.108 , pp. 201-205
    • Minzhong, Z.1    Liu, H.W.2
  • 5
    • 85176685033 scopus 로고
    • TX, Austin
    • G. Grossmann K. Heiduschke L. Weber Properties of thin films of Sn62Pb36Ag2 Proc. Electron. Manufact. Symp. 502 507 1995 TX, Austin
    • (1995) , pp. 502-507
    • Grossmann, G.1    Heiduschke, K.2    Weber, L.3
  • 6
    • 85176682460 scopus 로고    scopus 로고
    • TX, Austin
    • G. Grossmann L. Weber Lifetime assessment of soft solder joints on the base of the metallurgical behaviour of Sn62Pb36Ag2 Proc. Electron. Manufact. Symp. 256 263 1997 TX, Austin 4943 13621 626927
    • (1997) , pp. 256-263
    • Grossmann, G.1    Weber, L.2
  • 7
    • 85176670728 scopus 로고
    • M. C. Shine L. R. Fox H. D. Solomon G. R. Halford L. R. Keisand B. Leis
    • M. C. Shine L. R. Fox H. D. Solomon G. R. Halford L. R. Keisand B. Leis Low cycle fatigue ASTM STP 942 588 610 1988
    • (1988) , pp. 588-610
  • 8
    • 85176668970 scopus 로고
    • ETH Zu¨rich Switzerland
    • W. Engelmaier Reliable surface mount solder attachments through design and quality manufacturing Proc. Int. Workshop SMT Reliability Manufact. Issues 1992 ETH Zu¨rich Switzerland
    • (1992)
    • Engelmaier, W.1
  • 9
    • 0026908809 scopus 로고
    • Y. S. Pao A fracture mechanics approach to thermal fatigue life prediction of soldered joints IEEE Trans. Comp., Hybrids, Manufact. Technol. 15 559 570 1992 33 4187 159886
    • (1992) , vol.15 , pp. 559-570
    • Pao, Y.S.1
  • 10
    • 0021651241 scopus 로고
    • P. M. Hall Forces, moments, and displacements during thermal chamber cycling of leadless ceramic chip carriers soldered to printed boards IEEE Trans. Comp. Hybrids, Manufact. Technol. CHMT-7 314 327 1984
    • (1984) , vol.CHMT-7 , pp. 314-327
    • Hall, P.M.1

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.