Immersion-cooled heat sinks for electronics: Insight from high-speed photography

IEEE Transactions on Components and Packaging Technologies

Volumn 24, Issue 2, 2001, Pages 166-176

  Bhavnani, Sushil H ^a,b   Fournelle, Gilbert ^c   Jaeger, Richard C ^a,b  

^a IEEE   (United States)

^b AUBURN UNIVERSITY   (United States)

^c FORD MOTOR COMPANY   (United States)

Author keywords

Heat transfer augmentation; Liquid immersion cooling of microelectronics; Passive thermal enhancement; Thermal management of electronics

Indexed keywords

LIQUID IMMERSION COOLING;

COOLANTS; ELECTRONICS PACKAGING; HEAT FLUX; HEAT LOSSES; HEAT PIPES; HEAT TRANSFER; HIGH SPEED PHOTOGRAPHY; THERMODYNAMIC PROPERTIES;

HEAT SINKS;

EID: 0035363238     PISSN: 15213331     EISSN: None     Source Type: Journal    
DOI: 10.1109/6144.926379     Document Type: Article

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