Control of incipience hysteresis effects in liquid cooled electronics heat sinks

Journal of Electronics Manufacturing

Volumn 9, Issue 2, 1999, Pages 179-190

  Bhavnani, Sushil H ^a   Balch, Stacey E ^b   Jaeger, Richard C ^c  

^a AUBURN UNIVERSITY   (United States)

^b LEXMARK INTERNATIONAL INC   (United States)

^c AUBURN UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; COOLING; ELECTRIC LOSSES; MICROPROCESSOR CHIPS; MULTICHIP MODULES; SEMICONDUCTING SILICON; THERMAL CYCLING;

INCIPIENCE HYSTERESIS EFFECTS;

HEAT SINKS;

EID: 0033295104     PISSN: 09603131     EISSN: None     Source Type: Journal    
DOI: 10.1142/S0960313199000106     Document Type: Article

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