Integration and electrical characterization of photosensitive polyimide

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 19, Issue 3, 2001, Pages 774-779

  Alford, T L ^c   Zou, Y L ^a,c   Gadre, Kaustubh S ^c   King, C ^b,c   Chen, W ^b,c   Theodore, N David ^b,c  

^a MOTOROLA INC   (United States)

^b INTEL CORPORATION   (United States)

^c Arizona State University   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ETCHING; INTERFACES (MATERIALS); LEAKAGE CURRENTS; MOISTURE; PHOTOSENSITIVITY;

PHOTOSENSITIVE POLYIMIDES;

POLYIMIDES;

EID: 0035326214     PISSN: 10711023     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1364703     Document Type: Conference Paper

References (11)

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