Development of a rapid and automated TEM sample preparation method in semiconductor failure analysis and the study of the relevant TEM artifact

Microelectronics Journal

Volumn 32, Issue 3, 2001, Pages 221-226

  Dai, J Y ^a   Tee, S F ^a   Tay, C L ^a   Song, Z G ^a   Ansari, S ^a   Er, E ^a   Redkar, S ^a  

^a CHARTERED SEMICONDUCTOR MANUFACTURING LTD   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

AMORPHIZATION; ELECTRON ENERGY LOSS SPECTROSCOPY; ENERGY DISPERSIVE SPECTROSCOPY; ION BEAMS; ION IMPLANTATION; PROTECTIVE COATINGS; SEMICONDUCTING GALLIUM;

FOCUSED ION BEAMS (FIB);

TRANSMISSION ELECTRON MICROSCOPY;

EID: 0035281349     PISSN: 00262692     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0026-2692(00)00124-5     Document Type: Article

References (8)

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3. S. Morris, S. Tatti, E. Slack, N. Dickson, H. Mendez, B. Schwiesow, R. Ryle, The 17th International Symposium for Testing and Failure Analysis, Los Angeles, CA, USA, 11-15 November 1991, p. 417.
4. Overwijk M.H.F., van den Heuvel F.C., Bulle-Lieuwma C.W.T. J. Vac. Sci. Technol. B. II:1993;2021.
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6. L.R. Herlinger, S. Chevacharoenkul, D.C. Erwin, Proceedings of the 22nd International Symposium for Testing and Failure Analysis, 18-22 November, Los Angeles, CA, 1996, p. 199.
7. Z.G. Song, J.Y. Dai, S. Redkar, submitted for publication.
8. A.J. Leslie, K.L. Pey, K.S. Sim, M.T.F. Beh, G.P. Goh, 21st International Symposium For Testing and Failure Analysis, 6-10 November, Santa Clara, CA, 1995, p. 353.