Residual stress and in-situ thermal stress measurements of copper films on glass substrate

Materials Science Research International

Volumn 7, Issue 1, 2001, Pages 54-60

  Hanabusa, T ^a   Nishida, M ^a  

^a UNIVERSITY OF TOKUSHIMA   (Japan)

Author keywords

Cu film; In situ thermal stress; Residual stress; X ray stress measurement

Indexed keywords

COPPER; HYSTERESIS; RESIDUAL STRESSES; SPUTTERING; TENSILE STRENGTH; THERMAL CYCLING; THERMAL STRESS; X RAY DIFFRACTION ANALYSIS;

RADIO FREQUENCY (RF) SPUTTERING;

METALLIC FILMS;

EID: 0035267489     PISSN: 13411683     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (13)