Residual stress and its thermal relaxation in TiN films

Thin Solid Films

Volumn 281-282, Issue 1-2, 1996, Pages 344-347

  Matsue, Tatsuya ^a   Hanabusa, Takao ^b   Ikeuchi, Yasukazu ^a  

^a NIIHAMA NATIONAL COLLEGE OF TECHNOLOGY   (Japan)

^b UNIVERSITY OF TOKUSHIMA   (Japan)

Author keywords

Physical vapour deposition; Stress; Titanium nitride; X ray diffraction

Indexed keywords

ANNEALING; COATED MATERIALS; CRYSTAL LATTICES; CRYSTAL ORIENTATION; CRYSTAL STRUCTURE; ION BOMBARDMENT; RESIDUAL STRESSES; STRESS ANALYSIS; STRESS RELAXATION; THERMAL STRESS; TITANIUM NITRIDE; X RAY DIFFRACTION;

LATTICE STRAINS; THERMAL RELAXATION; X RAY STRESS MEASUREMENT;

THIN FILMS;

EID: 0030218504     PISSN: 00406090     EISSN: None     Source Type: Journal    
DOI: 10.1016/0040-6090(96)08632-4     Document Type: Article

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