Novel thin film polymer foaming technique for low and ultra low-k dielectrics

IEEE International Conference on Conduction and Breakdown in Solid Dielectrics

Volumn , Issue , 2001, Pages 187-190

  Krause, B ^a   Koops, G H ^a   Van der Vegt, N F A ^a   Wessling, M ^a   Wubbenhorst M ^a   Van Turnhout, J ^a  

^a UNIVERSITY OF TWENTE   (Netherlands)

Author keywords

[No Author keywords available]

Indexed keywords

BLOCK COPOLYMERS; FILM PREPARATION; FOAMED PLASTICS; NUCLEATION; PERMITTIVITY; PLASTIC FILMS; POROSITY; QUENCHING; SCANNING ELECTRON MICROSCOPY; SUPERCONDUCTING TRANSITION TEMPERATURE; SYNTHESIS (CHEMICAL);

POROUS STRUCTURES;

THIN FILMS;

EID: 0035204750     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (10)

1. In search of low-k dielectrics
2. Low dielectric constant polymers for microelectronics
3. Low dielectric, fluorinated polyimide copolymers
4. Nanoporous polyimides
5. Optimization of foaming process using triblock polyimides with thermally labile blocks
6. Synthesis and characterization of porous polyimide films for dielectric applications
7. Preparation of low density poly(methylsilsesquioxane)s for LSI interlayer dielectrics with low dielectric constant. Fabrication of Angstrom size pores prepared by baking trifluoropropylsilyl copolymers
8. Preparation and properties of porous polyimide films
9. Dielectric property and microstructure of a porous polymer material with ultralow dielectric constant
10. Microcellular foaming of amorphous high-Tg polymers using carbon dioxide