SCOPUS 정보 검색 플랫폼

Journal of Adhesion Science and Technology

Volumn 15, Issue 12, 2001, Pages 1403-1416

Thermal contact resistance and adhesion studies on thin copper films on alumina substrates

(5) Sakami, D a Lahmar, A a Scudeller, Y a Danes, F a Bardon, J P a

a Centre National de la Recherche Scientifique (France)

Author keywords

Adhesion; Alumina; Cu films; Thermal contact resistance

Indexed keywords

ADHESION; ALUMINA; ARGON; HEAT RESISTANCE; MATHEMATICAL MODELS; PHYSICAL VAPOR DEPOSITION; SCANNING ELECTRON MICROSCOPY; STRESSES; SUBSTRATES; SURFACE PROPERTIES; THIN FILMS; X RAY PHOTOELECTRON SPECTROSCOPY; METALLIC FILMS; THERMAL CONDUCTIVITY OF SOLIDS;

ALUMINA SUBSTRATES; COPPER FILMS; SCRATCH TEST; THERMAL CONTACT RESISTANCE;

COPPER; INTERFACES (MATERIALS);

ADHESION STUDIES; ALUMINA SUBSTRATES; ARGON PRESSURE; COPPER FILMS; COPPER THIN FILM; CRITICAL LOAD; CU FILMS; ENHANCEMENT OF HEAT TRANSFER; INTERFACE PROPERTY; INTERFACIAL AREAS; PHOTOTHERMAL METHODS; PHYSICAL VAPOUR DEPOSITION; SCRATCH TEST; STRESS LEVELS; THERMAL CONTACT RESISTANCE; THIN COPPER FILMS;

EID: 0035194018 PISSN: 01694243 EISSN: None Source Type: Journal
DOI: 10.1163/156856101753213268 Document Type: Article

Times cited : (13)

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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.