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Volumn 41, Issue 18, 1998, Pages 2781-2798

Thermal interface resistance and subsurface effusivity of submicron metallic films on dielectric substrates : An experimental method for simultaneous determination

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ALUMINA; COOLING; COPPER; DIELECTRIC MATERIALS; ELECTRIC RESISTANCE; GLASS; HEAT RESISTANCE; MATHEMATICAL MODELS; METALLIC FILMS; SENSITIVITY ANALYSIS; SURFACE PROPERTIES;

EID: 0032157888     PISSN: 00179310     EISSN: None     Source Type: Journal    
DOI: 10.1016/S0017-9310(98)00363-9     Document Type: Article
Times cited : (21)

References (18)
  • 12
    • 85205870850 scopus 로고    scopus 로고
    • Boley Weiner. NY : Wiley 1967. 4éme edition
    • Boley and Weiner. NY : Wiley 1967. 4éme edition.
  • 13
    • 85205840579 scopus 로고
    • Ph.D. thesis, December
    • Hmina N. Ph.D. thesis, December, 1994.
    • (1994)
    • Hmina, N.1


* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.