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Volumn 41, Issue 18, 1998, Pages 2781-2798
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Thermal interface resistance and subsurface effusivity of submicron metallic films on dielectric substrates : An experimental method for simultaneous determination
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Author keywords
[No Author keywords available]
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Indexed keywords
ADHESION;
ALUMINA;
COOLING;
COPPER;
DIELECTRIC MATERIALS;
ELECTRIC RESISTANCE;
GLASS;
HEAT RESISTANCE;
MATHEMATICAL MODELS;
METALLIC FILMS;
SENSITIVITY ANALYSIS;
SURFACE PROPERTIES;
SUBSURFACE EFFUSIVITY;
INTERFACES (MATERIALS);
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EID: 0032157888
PISSN: 00179310
EISSN: None
Source Type: Journal
DOI: 10.1016/S0017-9310(98)00363-9 Document Type: Article |
Times cited : (21)
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References (18)
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