SCOPUS 정보 검색 플랫폼

Volumn 325, Issue 1-2, 1998, Pages 156-162

Correlation between the adhesion and the thermal contact resistance: Effects of substrate surface ion bombardment etching

(4) Lahmar, A a Hmina, N a Scudeller, Y a Bardon, J P a

a Centre National de la Recherche Scientifique (France)

Author keywords

Adhesion; Ceramic; Cu films; Ion etching; Mean critical load; Scratch test; Thermal contact resistance; X ray photoelectron spectroscopy

Indexed keywords

ADHESION; ALUMINA; ARGON; CERAMIC MATERIALS; COPPER; ETCHING; HEAT RESISTANCE; INTERFACES (MATERIALS); ION BOMBARDMENT; MATERIALS TESTING; SUBSTRATES; TEMPERATURE MEASUREMENT;

THERMAL CONTACT RESISTANCE;

METALLIC FILMS;

EID: 0032115378 PISSN: 00406090 EISSN: None Source Type: Journal
DOI: 10.1016/S0040-6090(97)00699-8 Document Type: Article

Times cited : (12)

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17
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* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.