Application of a multi-step quartz etching method to strong PSMs

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4409, Issue , 2001, Pages 118-124

  Kim, H D ^a   Kim, Y H ^a   Choi, S W ^a   Han, W S ^a   Sohn, J M ^a  

^a SAMSUNG Electronics   (South Korea)

Author keywords

Mixed etching method; Multi step etching method; Phase uniformity; Qz etching; Strong PSM; X phenomenon

Indexed keywords

COMPUTER SIMULATION; ETCHING; QUARTZ; SEMICONDUCTOR DEVICE MANUFACTURE; SUBSTRATES;

MIXED ETCHING METHOD; MULTI-STEP QUARTZ ETCHING METHOD; PHASE SHIFTING MASKS; PHASE UNIFORMITY;

MASKS;

EID: 0035189476     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.438334     Document Type: Conference Paper

References (6)

1. The application of alternating phase-shifting masks to 140nm gate patterning (II): Mask design and manufacturing tolerances
2. Revalidation of the Reyleigh resolution and DOF limits
3. Improving resolution in photolithography with a phase shifting mask
4. Through-focus image balancing of alternating phase-shifting masks
5. Phase-shifting mask topography effect on lithographic image quality