Yield improvement through cycle time and process fluctuation analyses

IEEE International Symposium on Semiconductor Manufacturing Conference, Proceedings

Volumn , Issue , 2001, Pages 267-270

  Chang, W C ^a   Yu, M ^a   Wu, R ^a   Chen, C ^a   Chen, J ^a   Hsieh, C Y ^a   Wang, C K ^a  

^a Science Based Industrial Park   (Taiwan)

Author keywords

[No Author keywords available]

Indexed keywords

CHEMICAL MECHANICAL POLISHING; CORRELATION METHODS; WSI CIRCUITS;

CYCLE TIME;

SEMICONDUCTOR DEVICE MANUFACTURE;

EID: 0035166016     PISSN: 1523553X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. Correlation between yield and waiting time: A quantitative study
2. On the relationship between yield and cycle time in semiconductor wafer fabrication
3. Cycle time reduction for semiconductor wafer fabrication facilities
4. Empirical results on the relationship between die yield and cycle time in semiconductor wafer fabrication
5. Yield analysis and improvement by reducing manufacturing fluctuation noise