Electrostatic chuck with a thin ceramic insulation layer for wafer holding

Conference Record - IAS Annual Meeting (IEEE Industry Applications Society)

Volumn 1, Issue , 2001, Pages 399-403

  Yatsuzuka, K ^a   Toukairin, J ^a   Asano, K ^a   Aonuma, S ^a  

^a YAMAGATA UNIVERSITY   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

CERAMIC MATERIALS; ELECTRIC INSULATING MATERIALS; ELECTRIC POTENTIAL; ELECTRODES; ELECTRONICS INDUSTRY; ELECTROSTATICS; HEAT RESISTANCE; POLYETHYLENES; SILICON WAFERS; THIN FILMS; VACUUM;

ELECTROSTATIC CHUCK; SEMICONDUCTOR INDUSTRY; THIN CERAMIC INSULATION LAYER; THIN CERAMIC PLATE; WAFER HOLDING;

ELECTROSTATIC DEVICES;

EID: 0035152072     PISSN: 01972618     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (5)

1. Electrostatic wafer holding
2. Effect of additives on the electrostatic force of alumina electrostatic chucks
3. Electrostatic wafer chuck for electron beam microfabrication
4. Fundamental study of an electrostatic chuck for silicon wafer handling
5. Fundamental characteristics of electrostatic wafer chuck with insulating sealant