Silicon nitride as an effective protection against oxidation of a TiNi thin film in high temperature oxidizing air environment at atmospheric pressure

Journal of Vacuum Science and Technology B: Microelectronics and Nanometer Structures

Volumn 19, Issue 1, 2001, Pages 305-307

  Roch, I ^a   Buchaillot, L ^a   Wallart, X ^a   Collard, D ^a  

^a INSTITUT D ELECTRONIQUE   (France)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; ATMOSPHERIC PRESSURE; CRYSTAL GROWTH; DIFFUSION IN GASES; HIGH TEMPERATURE EFFECTS; OXIDATION RESISTANCE; PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION; THERMOOXIDATION; THIN FILMS; TITANIUM NITRIDE; X RAY PHOTOELECTRON SPECTROSCOPY;

ADHESION COATINGS;

PROTECTIVE COATINGS;

EID: 0035081953     PISSN: 0734211X     EISSN: None     Source Type: Journal    
DOI: 10.1116/1.1338552     Document Type: Article

References (12)

1. C. L. Chu, S. K. Wu, and Y. C. Yen, Mater. Sci. Eng., A 216, 193 (1996).
2. S. Miyazaki, A. Ishida, and A. Takei, Meas. Control Robotics Proc. 495 (1992).
3. A. P. Jardine, H. Zhang, and L. D. Wasielesky, Mater. Res. Soc. Symp. Proc. 187, 181 (1990).
4. A. D. Johnson, J. Micromech. Microeng. 1, 34 (1991).
5. J. A. Walker, K. J. Gabriel, and M. Mehregany, Sens. Actuators A 21, 243 (1990).
6. S. Miyazaki, T. Hashinaga, K. Yumikura, U. Horikawa, T. Ueki, and A. Ishida, Proc. SPIE 2441, 156 (1995).
7. E. Quandt, C. Halene, H. Holleck, K. Feit, M. Kohl, and P. Schlossmacher, Int. Conf. Solid-State Sens. and Actuators Proc. 282-PA11, 202 (1995).
8. T. Lehnert, S. Tixier, P. Böni, and R. Gotthardt, Mater. Sci. Eng., A 273, 713 (1999).
9. K. Ikuta, M. Hayashi, and T. Matsuura, IEEE Micro Electro Mechanical Systems Proc. 355 (1994).
10. J.-L. Seguin, M. Bendahan, A. Isalgue, V. Esteve-Cano, H. Carchano, and V. Torra, Sens. Actuators A 74, 65 (1999).
11. S. K. Wu, H. C. Lin, and Y. C. Yen, Mater. Sci. Eng., A 215, 113 (1996).
12. I. Roch, L. Buchaillot, and X. Wallart, Shape Memory Superelastic Technologies Proc. (to be published).