SCOPUS 정보 검색 플랫폼

Thin Solid Films

Volumn 318, Issue 1-2, 1998, Pages 239-242

A cross-sectional high-resolution transmission electron microscopy study of electrodeposited Ni-Cu/Cu multilayers

(5) Cziraki A a Pierron Bohnes, V b Ulhaq Bouillet, C b Toth Kadar E c Bakonyi, I c

a EÖTVÖS LORÁND UNIVERSITY (Hungary)

b INSTITUT DE PHYSIQUE ET CHIMIE DES MATÉRIAUX DE STRASBOURG (France)

c INSTITUTE OF EXPERIMENTAL MEDICINE (Hungary)

Author keywords

Electrodeposition; Giant magnetoresistance; High resolution transmission electron microscopy; Ni Cu Cu multilayers

Indexed keywords

COPPER; ELECTRODEPOSITION; INTERFACES (MATERIALS); MAGNETORESISTANCE; MONOLAYERS; NICKEL ALLOYS; STRAIN; SURFACE ROUGHNESS; TRANSMISSION ELECTRON MICROSCOPY;

GIANT MAGNETORESISTANCE; LATTICE MISMATCH;

METALLIC SUPERLATTICES;

EID: 0032049865 PISSN: 00406090 EISSN: None Source Type: Journal
DOI: 10.1016/S0040-6090(97)01184-X Document Type: Article

Times cited : (21)

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