High density optoelectronic interconnect using micro-machined spring arrays

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4285, Issue , 2001, Pages 183-190

  Chua, C L ^a   Fork, D K ^a   Smith, D L ^a  

^a PALO ALTO RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CMOS INTEGRATED CIRCUITS; ELECTRIC CONTACTS; FLIP CHIP DEVICES; MICROMACHINING; QUARTZ; ROBUSTNESS (CONTROL SYSTEMS); SPRINGS (COMPONENTS); SPUTTERING; SUBSTRATES; THIN FILMS;

MICRO-MACHINED SPRING ARRAYS;

OPTICAL INTERCONNECTS;

EID: 0034944832     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: 10.1117/12.426886     Document Type: Conference Paper

References (3)

1. Densely-packed surface-emitting laser arrays for printing applications
2. Independently addressable VCSEL arrays on 3 μm pitch
3. A new flip-chip technology for high-density packaging