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Volumn 11, Issue 3, 2001, Pages
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Comparative study of atomic layer deposition and low-pressure MOCVD of copper sulfide thin films
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Author keywords
[No Author keywords available]
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Indexed keywords
CHEMICAL VAPOR DEPOSITION;
COPPER COMPOUNDS;
FILM PREPARATION;
GRAIN SIZE AND SHAPE;
PHASE TRANSITIONS;
THIN FILMS;
ATOMIC LAYER DEPOSITION;
METALLIC FILMS;
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EID: 0034848811
PISSN: 11554339
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1051/jp4:20013144 Document Type: Conference Paper |
Times cited : (4)
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References (18)
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