Submicron micromachining on silicon wafer using femtosecond pulse laser

Journal of Laser Applications

Volumn 13, Issue 1, 2001, Pages 41-43

  Ngoi, Bryan K A ^a   Venkatakrishnan, K ^a   Lim, L E N ^a   Tan, B ^a  

^a NANYANG TECHNOLOGICAL UNIVERSITY   (Singapore)

Author keywords

[No Author keywords available]

Indexed keywords

HARMONIC GENERATION; LASER BEAM EFFECTS; LIGHT SOURCES; MICROMACHINING; OPTICAL INSTRUMENT LENSES; SILICON WAFERS; SOLID STATE LASERS; THERMAL DIFFUSION IN SOLIDS;

FEMTOSECOND PULSE LASERS; SECOND HARMONIC RADIATION; SUBMICRON MICROMACHINING; ULTRASHORT PULSE DURATION;

PULSED LASER APPLICATIONS;

EID: 0034831771     PISSN: 1042346X     EISSN: None     Source Type: Journal    
DOI: 10.2351/1.1340338     Document Type: Article

References (3)

1. P. P. Pronko, S. K. Dutta, J. Squier, J. V. Rudd, D. Du, and G. Mourou, "Machining of submicron holes using a femtosecond laser at 800 nm," Opt. Commun. 114, 106-110 (1995).
2. X. Liu, D. Du, and G. Mourou, "Laser ablation and micromachining with ultrashort laser pulses," IEEE J. Quantum Electron. 33, 1706-1716 (1997).
3. X. Liu, "Submicon lines in thin metal films micromachined by an ultrafast laser oscillator," Technical Digest-Conference on Lasers and Electro-Optics, 1998, p. 511.