Optimization of SMD assembly systems regarding dynamical and thermal behavior

Proceedings of the IEEE International Symposium on Assembly and Task Planning

Volumn , Issue , 2001, Pages 172-177

  Feldmann, K ^a   Krimi, S ^a   Boiger, M ^a   Zolleiss, B ^a  

^a UNIVERSITY OF ERLANGEN NUREMBERG   (Germany)

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY; DATA ACQUISITION; ELECTRONICS PACKAGING; OPTIMIZATION; QUALITY ASSURANCE; SEMICONDUCTOR DEVICE MANUFACTURE; SENSORS; THERMODYNAMIC PROPERTIES;

SURFACE MOUNT DEVICE; THERMAL BEHAVIOR;

COMPUTER INTEGRATED MANUFACTURING;

EID: 0034829568     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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