Distributed models for multi-terminal capacitors - using 2D lossy transmission-line approach

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2001, Pages 344-347

  Li, Y L ^a   Elzinga, M ^a   Yahyaei moayyed, F ^a  

^a INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; ELECTRIC CURRENTS; ELECTRIC POWER SUPPLIES TO APPARATUS; ELECTRONICS INDUSTRY; ELECTRONICS PACKAGING; INDUCTANCE MEASUREMENT; MATHEMATICAL MODELS; NATURAL FREQUENCIES; PRINTED CIRCUIT BOARDS; SPURIOUS SIGNAL NOISE; TRANSMISSION LINE THEORY;

DIE SIDE CAPACITOR; DISTRIBUTED MODEL; MULTITERMINAL CAPACITOR; SIMULTANEOUS SWITCHING NOISE;

CAPACITORS;

EID: 0034829252     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (15)

1. On the effectiveness of decoupling capacitors in reducing EM radiation from PCBs
2. Effectiveness of multiple decoupling capacitors
3. The steealth decoupling capacitor
4. Modeling and analysis of multichip module power supply planes
5. An experimental procedure for characterizing interconnects to the DC power bus on a multilayer printed circuit board
6. Decoupling capacitor effects on switching noise
7. Noise computation in single chip packages
8. A new technique for high frequency characterization of capacitors
9. A new technique for high frequency characterization of capacitors
10. Validation of integrated capacitor-via-planes model
11. Shorting via arrays for the elimination of package resonance to reduce power supply noise in multi-layered area-array IC packages
12. Integrated modeling methodology for core and I/O power delivery