Validation of integrated capacitor-via-planes model

IEEE Topical Meeting on Electrical Performance of Electronic Packaging

Volumn , Issue , 1999, Pages 121-124

  Li, Yuan Li,ang ^a   Figueroa, David G ^a   Yew, Teong Guan ^a   Chung, Chee Yee ^a  

^a INTEL CORPORATION   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITORS; ELECTRIC GROUNDING; ELECTRIC POWER DISTRIBUTION; ELECTRONICS PACKAGING; MATHEMATICAL MODELS;

INTEGRATED CAPACITOR-VIAS-PLANES MODELS;

ELECTRIC POWER SYSTEMS;

EID: 0033328774     PISSN: None     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (13)