Proposal the assessing method of the CSP's mechanical reliability on board

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 3906, Issue , 1999, Pages 682-687

  Yamaji, Yasuhisa ^a   Yamasaki, Hirofumi ^a   Juso, Hiroyuki ^a   Ohsono, Mitsuaki ^a   Kimura, Tomoshi ^a   Fujita, Kazuya ^a   Chikawa, Yasunori ^a   Kako, Noritoshi ^a  

^a SHARP CORPORATION   (Japan)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; MECHANICAL PROPERTIES; MECHANICAL TESTING; MULTICHIP MODULES; RELIABILITY; STRAIN GAGES; STRAIN MEASUREMENT; THERMAL CYCLING;

CHIP SIZE PACKAGE; MECHANICAL STRESS TEST; TEMPERATURE CYCLE TEST; THERMAL STRESS TEST;

PRINTED CIRCUIT BOARDS;

EID: 0033348361     PISSN: 0277786X     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (7)