Evaluation of Cu capping alternatives for polyimide-Cu MCM-D

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2001, Pages 1187-1192

  Perfecto, E ^a   Lee, K W ^a   Hamel, H ^a   Wassick, T ^a   Cline, C ^a   Oonk, M ^a   Feger, C ^a   McHerron, D ^a  

^a IBM MICROELECTRONICS   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ADHESION; CAPACITANCE; COPPER; CURING; DIFFUSION; ESTERS; MULTICHIP MODULES; ORGANIC ACIDS; ORGANIC COATINGS; PERMITTIVITY; POLYIMIDES; WETTING;

BENZOTRIAZOLE; ORGANIC CAPPING; POLYAMIC ACID PRECURSOR; POLYAMIC ESTER; TETRAZOLE;

ELECTRONIC EQUIPMENT TESTING;

EID: 0034825925     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

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