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Volumn , Issue , 1994, Pages 87-92
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Effect of contamination on copper migration in TAB tape structures
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Author keywords
[No Author keywords available]
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Indexed keywords
CHLORINE COMPOUNDS;
CONDUCTIVE MATERIALS;
CONTAMINATION;
COPPER;
ELECTRIC TAPES;
FAILURE ANALYSIS;
IMPURITIES;
INTEGRATED CIRCUITS;
MAGNETIC TAPE;
MOISTURE;
PRECIPITATION (CHEMICAL);
STRESSES;
BIASED MOISTURE STRESS;
CONTAMINATION EFFECT;
COPPER MIGRATION;
TAPE AUTOMATED BONDING (TAB) TAPE;
SEMICONDUCTOR DEVICE STRUCTURES;
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EID: 0028348619
PISSN: 00999512
EISSN: None
Source Type: Conference Proceeding
DOI: 10.1109/relphy.1994.307852 Document Type: Conference Paper |
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Times cited : (11)
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References (10)
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