A study of normal, restoring, and fillet forces and solder bump geometry during reflow in concurrent underfill/reflow flip chip assembly

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 2001, Pages 699-703

  Zhao, R ^a   Zhang, Y ^a   Johnson, R W ^a   Harris, D K ^a  

^a AUBURN UNIVERSITY   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY; COMPOSITION EFFECTS; COMPUTER SIMULATION; INTERFACES (MATERIALS); SOLDERED JOINTS; SURFACE TENSION; VOLUME FRACTION;

CONCURRENT UNDERFILL; DIE FLOATING; FILLET FORCES; REFLOW; SELF CENTERING FORCES; SOLDER BUMP GEOMETRY;

FLIP CHIP DEVICES;

EID: 0034823073     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Conference Paper

References (8)

1. The development of reflowable materials systems to integrate the reflow and underfill dispensing processes for DCA/FCOB assembly
2. Adhesive and encapsulant materials with fluxing properties
3. Shape and force relationship for molten axisymmetric solder connections
4. Quasi-static modeling of the self-alignment mechanism in flip-chip soldering - Part I: Single solder joint
5. Design of solder joints for self-aligned optoelectronic assemblies
6. Prediction of solder joint geometries in array-type interconnects