Development of reflowable materials systems to integrate the reflow and underfill dispensing processes for DCA/FCOB assembly

IEEE transactions on components, packaging and manufacturing technology. Part C. Manufacturing

Volumn 20, Issue 3, 1997, Pages 183-187

  Gamota, Daniel R ^a   Melton, Cindy M ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; EUTECTICS; FINITE VOLUME METHOD; FLIP CHIP DEVICES; LEAD; PRINTED CIRCUIT TESTING; SURFACE MOUNT TECHNOLOGY; THERMAL CYCLING; TIN;

ACCELERATED LIFE TESTING (ALT); DIRECT CHIP ATTACH; FLIP CHIPS ON BOARD (FCOB); LIQUID THERMAL SHOCKS; REFLOWABLE MATERIAL SYSTEMS;

PRINTED CIRCUIT MANUFACTURE;

EID: 0031175635     PISSN: 10834400     EISSN: None     Source Type: Journal    
DOI: 10.1109/3476.649438     Document Type: Article

References (7)

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2. D. R. Gamota Encapsulant materials systems for flip chip on board assemblies: Addressing manufacturing issues Proc. NEPCON West 24 34 1997 CA, Anaheim
3. R. Pennisi Adhesive and encapsulant material with fluxing properties U.S. Patent 5 128 746
4. R. J. Wassink Soldering in Electronics. 1989 J. W. Arrowsmith U.K., London
5. H. Lee K. Neville Handbook of Epoxy Resins 1967 McGraw-Hill New York
6. D. Suryanarayana T. Y. Wu J. A. Varcoe Encapsulants used in flip-chip packages IEEE Trans. Comp., Hybrids, Manufact., Technol. 16 Dec. 1993 33 6773 273685
7. D. W. Wang K. I. Papathomas Encapsulant for fatigue life enhancement of controlled collapse chip connection (C4) IEEE Trans. Comp., Hybrids, Manufact., Technol. 16 Dec. 1993 33 6773 273686