Capacitance characterization of surface mount electronics packages

International Journal of Microcircuits and Electronic Packaging

Volumn 21, Issue 1, 1998, Pages 67-72

  Wen, Yenting ^a   Tsai, Chi Taou ^a  

^a MOTOROLA INC   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CAPACITANCE MEASUREMENT; COMPUTER SIMULATION; PRODUCT DESIGN; PRODUCT DEVELOPMENT; SURFACE MOUNT TECHNOLOGY;

AUTO BALANCING BRIDGE; GUARDING MECHANISM; SURFACE MOUNT PACKAGES;

ELECTRONICS PACKAGING;

EID: 0032010298     PISSN: 10631674     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (7)