High volume capable direct chip attachment methods

Proceedings - Electronic Components and Technology Conference

Volumn , Issue , 1999, Pages 441-445

  Kulojarvi, K ^a   Pienimaa, S ^a   Kivilahti, J K ^a  

^a NOKIA RESEARCH CENTER   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ASSEMBLY; BONDING; ELECTRONICS PACKAGING; INTEGRATED CIRCUIT MANUFACTURE; SOLDERING ALLOYS; SURFACE MOUNT TECHNOLOGY;

HIGH VOLUME CAPABLE DIRECT CHIP ATTACHMENT METHODS; TRANSFUSION BONDING;

FLIP CHIP DEVICES;

EID: 0032639447     PISSN: 05695503     EISSN: None     Source Type: Conference Proceeding    
DOI: None     Document Type: Article

References (8)