A rotation-invariant and non-referential approach for ball grid array (BGA) substrate conducting path inspection

International Journal of Advanced Manufacturing Technology

Volumn 17, Issue 6, 2001, Pages 412-424

  Yeh, C H ^a   Tsai, D M ^a  

^a YUAN ZE UNIVERSITY   (Taiwan)

Author keywords

BGA substrate conduct path; Covariance matrix; Defect classification; Defect detection; Discrimination rules; Rotation invariant

Indexed keywords

COMPUTER VISION; DEFECTS; EIGENVALUES AND EIGENFUNCTIONS; INSPECTION; MATRIX ALGEBRA; SUBSTRATES;

BALL GRID ARRAY; COVARIANCE MATRIX; DEFECT CLASSIFICATION; DEFECT DETECTION; DISCRIMINATION RULES; ROTATION INVARIANT; SUBSTRATE CONDUCTING PATH INSPECTION;

PRINTED CIRCUIT MANUFACTURE;

EID: 0034812732     PISSN: 02683768     EISSN: None     Source Type: Journal    
DOI: 10.1007/s001700170159     Document Type: Article

References (18)

1. Ultra-fine feature printed circuits and multi-chip modules
2. Evaluation of reliability of μBGA solder joints through twisting and bending
3. Automatic PCB inspection algorithms: A survey
4. Automatic inspection system for printed circuit boards
5. Minimum storage boundary tracing algorithm and its application to automatic inspection
6. Automated inspection of printed circuit boards through machine vision
7. A system for the automatic visual inspection of bare-printed circuit boards
8. Automatic non-reference inspection of printed wiring boards
9. Automated visual inspection of bare printed circuit boards
10. Latest image evaluation systems aid efforts for product quality
11. Novel method for analysis of printed circuit images
12. Segmentation of printed circuit board images into basic patterns
13. A subpattern level inspection system for printed circuit board
14. Statistical grey-level models for object location and identification
15. Boundary-based corner detection using eigenvalues of covariance matrices
16. Quality verification with real-time x-ray