Quality verification with X real-time -ray

SMT Surface Mount Technology Magazine

Volumn 13, Issue 8, 1999, Pages 49-52

  Amtower, Richard ^a  

^a CR Technology Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

ELECTRONICS PACKAGING; IMAGING SYSTEMS; INSPECTION; PRINTED CIRCUIT BOARDS; QUALITY CONTROL; REAL TIME SYSTEMS; SOLDERING; X RAY ANALYSIS;

REAL-TIME X RAY; VOID MEASUREMENT; X RAY INSPECTION SYSTEMS;

INTEGRATED CIRCUIT TESTING;

EID: 0002130657     PISSN: 15298930     EISSN: None     Source Type: Journal    
DOI: None     Document Type: Article

References (9)

1. "Market Trends: EGA Update," SMT, September 1998.
2. A. Lewis and P. Chang, "Ensuring High EGA Assembly Yield," SMT, August 1998.
3. R. Adams, et'al., "Underhood Reliability of PBGAs," SMT, August 1998.
4. Ning-Cheng Lee and K. Rändle, 'Voiding in EGA at the Solder-bumping Stage," journal of Surface Mount Technology, July 1998.
5. A. Primavera, et.al., "Factors that Affect Void Formation in EGA Assembly," Journal of Surface Mount Technology, January 1999.
6. D. Miller, "X-ray Inspection Systems," Advanced Packaging, June 1998.
7. R. Amtower, "Advanced X-ray Techniques for Improved EGA Inspection," Proceedings of Test, Assembly and Packaging Vision Conference, SEMICON West '98.
8. G. Olachea, "Electronics and 1C Packaging: Forecasting History," Gil Olachea, presentation at SMTA general meeting, March 1998, Anaheim, Calif.
9. I. Boruch, Amkor Electronics, keynote address to the Test, Assembly and Packaging Conference, February 1997.