Development of a bond contribution model for structure: Property correlations in dry etch studies

Proceedings of SPIE - The International Society for Optical Engineering

Volumn 4345, Issue 1, 2001, Pages 945-951

  Yu, Tianyue ^a   Ching, Philip ^a   Ober, Christopher ^a   Deshpande, Shreeram ^b   Puligadda, Rama ^b  

^a School of Operations Research and Industrial Engineering   (United States)

^b BREWER SCIENCE INC   (United States)

Author keywords

Dry Etch Resistance; Photoresist; Structure: Property Correlation

Indexed keywords

ANTIREFLECTION COATINGS; CHEMICAL BONDS; CHROMOPHORES; DRY ETCHING; ERROR ANALYSIS; GRAFTING (CHEMICAL); MATHEMATICAL MODELS; ORGANIC POLYMERS; PHOTORESISTS; REACTIVE ION ETCHING; SEMICONDUCTOR DEVICE MANUFACTURE; SILICON WAFERS; SPIN COATING; ULTRAVIOLET RADIATION;

HETEROATOMS;

PLASMA ETCHING;

EID: 0034764023     PISSN: 0277786X     EISSN: None     Source Type: Journal    
DOI: 10.1117/12.436819     Document Type: Article

References (3)