Estimation of the thermal band gap of a semiconductor from Seebeck measurements

Journal of Electronic Materials

Volumn 28, Issue 7, 1999, Pages 869-872

  Goldsmid, H J ^a   Sharp, J W ^a  

^a Marlow Industries Inc   (United States)

Author keywords

[No Author keywords available]

Indexed keywords

CARRIER MOBILITY; ELECTRON TRANSPORT PROPERTIES; ENERGY GAP; FERMI LEVEL; NUMERICAL METHODS; SEEBECK EFFECT; TEMPERATURE;

MASS RATIOS; SEEBECK COEFFICIENT; THERMAL BAND GAP; TRANSPORT PARAMETERS;

SEMICONDUCTOR MATERIALS;

EID: 0032645347     PISSN: 03615235     EISSN: None     Source Type: Journal    
DOI: 10.1007/s11664-999-0211-y     Document Type: Article

References (5)

1. E. Müller, W. Heiliger, P. Reinshaus and H. Süssmann, to be published, Proc. 15th Intl. Conf. on Thermoelectrics, Pasadena, (1996).
2. Landolt-Bornstein, New Series III/22A.
3. M. Situmorang and H.J. Goldsmid, Proc. First European Conf. of Thermoelectrics, Cardiff, (1987), p. 135.
4. R.P. Chasmar and R. Stratton, J. Electronic Control 7, 52 (1959).
5. G. Mahan, J. Appl. Phys. 65, 1578 (1989).