SCOPUS 정보 검색 플랫폼

Proceedings of the IEEE Ultrasonics Symposium

Volumn 1, Issue , 2000, Pages 699-704

New methodology for the design of advanced ultrasonic transducers for welding devices

a Oerlikon Assembly Equipment AG (Switzerland)

Author keywords

[No Author keywords available]

Indexed keywords

COMPUTER SIMULATION; FINITE ELEMENT METHOD; FRICTION; INTERFEROMETRY; NATURAL FREQUENCIES; PARAMAGNETIC RESONANCE; STRESS ANALYSIS; ULTRASONIC WELDING; VIBRATION CONTROL; WELDING MACHINES;

LASER INTERFEROMETRY;

ULTRASONIC TRANSDUCERS;

EID: 0034579581 PISSN: 10510117 EISSN: None Source Type: Conference Proceeding
DOI: None Document Type: Conference Paper

Times cited : (10)

References (11)

1
- 0003717016
- McGraw-Hill, New York
- (1997) Wire bonding in microelectronics
- Harman, G.¹

2
- 0003097553
- High frequency wire bonding for ultra fine pitch applications
- Singapore
- (1998) Semicon/Test, Assembly & Packaging Proceedings , pp. 208
- Onda, N.¹ Jaecklin, V.² Arsalane, S.³

3
- 30844449907
- High-frequency enhancement for ambient temperature ball bonding
- August
- (1997) Semiconductor International , pp. 93
- Ramsey, H.¹ Alfaro, C.²

4
- 0000740861
- Room temperature ball bonding using high ultrasonic frequencies
- Singapore
- (1995) Semicon/Test, Assembly & Packaging Proceedings , pp. 208
- Jaecklin, V.¹

5
- 0031994321
- Welding characteristics and temperature rise of high frequency and complex vibration ultrasonic wire bonding
- Delft, Holland
- (1997) Ultrasonics International 1997 Proceedings , pp. 59
- Tsujino, J.¹ Yoshihara, H.² Kamimoto, K.³ Osada, Y.⁴

6
- 84932197883
- Effect of ultrasound on deformation characteristics of metals
- (1966) IEEE Transactions on Sonics and Ultrasonics , vol.SU-13 , Issue.1 , pp. 1
- Langenecker, B.¹

7
- 0004294699
- Physik-Verlag, Weinheim
- (1987) Ultraschalltechnik
- Millner, R.¹

8
- 0003405853
- PhD Thesis, Institute of Technology Eindhoven, Holland
- (1984) The design of ultrasonic resonators with wide output cross-sections
- Derks, P.¹

9
- 0031345453
- High-frequency longitudinal-transverse complex vibration systems for ultrasonic wire bonding
- Toronto, Canada
- (1997) 1997 IEEE Ultrasonics Symposium Proceedings , pp. 849
- Tsujino, J.¹ Yoshihara, H.² Kamimoto, K.³ Osada, Y.⁴

10
- 0004220739
- Verity Instruments Inc., USA Patent, 5 364 005
- (1994) Ultrasonic transducer and mount
- Whelan, M.¹

11
- 0003956146
- ESEC SA, European Patent, EP 0 934 794 Al, August
- (1999) Ultrasonic transducer with a flange for mounting on an ultrasonic welding device, in particular on a wire bonder
- Parrini, L.¹

* 이 정보는 Elsevier사의 SCOPUS DB에서 KISTI가 분석하여 추출한 것입니다.